CDR13BG9R1EKZS
vs
100B9R1KTN500XC100
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
AVX CORP
KYOCERA AVX COMPONENTS CORP
Package Description
, 1111
CHIP
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
HTS Code
8532.24.00.20
Capacitance
0.0000091 µF
0.0000091 µF
Capacitor Type
CERAMIC CAPACITOR
CERAMIC CAPACITOR
Dielectric Material
CERAMIC
CERAMIC
Height
2.59 mm
2.59 mm
JESD-609 Code
e0
e3
Length
2.79 mm
2.79 mm
Mounting Feature
SURFACE MOUNT
SURFACE MOUNT
Multilayer
Yes
Yes
Negative Tolerance
10%
10%
Number of Terminals
2
2
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Style
SMT
SMT
Packing Method
Waffle Pack
Positive Tolerance
10%
10%
Rated (DC) Voltage (URdc)
500 V
500 V
Reference Standard
MIL-PRF-55681
Size Code
1111
1111
Surface Mount
YES
YES
Temperature Characteristics Code
BG
BG
Temperature Coefficient
90+/-20ppm/Cel ppm/°C
90+/-20ppm/Cel ppm/°C
Terminal Finish
Tin/Lead (Sn/Pb)
Tin (Sn)
Terminal Shape
WRAPAROUND
WRAPAROUND
Width
2.79 mm
2.79 mm
Base Number Matches
1
1
Rated (AC) Voltage (URac)
353.5 V
Compare CDR13BG9R1EKZS with alternatives
Compare 100B9R1KTN500XC100 with alternatives