CDR03BX333BKUSAB
vs
CDR03BX333BKSP
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
VISHAY INTERTECHNOLOGY INC
AVX CORP
Package Description
CHIP
, 1808
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8532.24.00.20
8532.24.00.20
Factory Lead Time
18 Weeks
28 Weeks
Capacitance
0.033 µF
0.033 µF
Capacitor Type
CERAMIC CAPACITOR
CERAMIC CAPACITOR
Dielectric Material
CERAMIC
CERAMIC
Height
2.03 mm
2.032 mm
JESD-609 Code
e0
e0
Length
4.57 mm
4.572 mm
Mounting Feature
SURFACE MOUNT
SURFACE MOUNT
Multilayer
Yes
Yes
Negative Tolerance
10%
10%
Number of Terminals
2
2
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Shape
RECTANGULAR PACKAGE
RECTANGULAR PACKAGE
Package Style
SMT
SMT
Packing Method
BULK
BULK
Positive Tolerance
10%
10%
Rated (DC) Voltage (URdc)
100 V
100 V
Reference Standard
MIL-PRF-55681/1
MIL-PRF-55681
Size Code
1808
1808
Surface Mount
YES
YES
Temperature Characteristics Code
BX
BX
Temperature Coefficient
15% ppm/°C
15% ppm/°C
Terminal Finish
Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
Tin/Lead (Sn/Pb)
Terminal Shape
WRAPAROUND
WRAPAROUND
Width
2.03 mm
2.032 mm
Base Number Matches
1
1
Pbfree Code
Compare CDR03BX333BKUSAB with alternatives
Compare CDR03BX333BKSP with alternatives