CDR03BX333BKSS vs CDR03BX333BKWSAR feature comparison

CDR03BX333BKSS KEMET Corporation

Buy Now Datasheet

CDR03BX333BKWSAR Vishay Intertechnologies

Buy Now Datasheet
Pbfree Code No
Rohs Code No No
Part Life Cycle Code Active Not Recommended
parentfamilyid 1102607
Ihs Manufacturer KEMET ELECTRONICS CORP VISHAY INTERTECHNOLOGY INC
Package Description , 1808 CHIP
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8532.24.00.20 8532.24.00.20
Factory Lead Time 18 Weeks 18 Weeks
Category CO2 Kg 3.7 3.59
Compliance Temperature Grade Military: -55C to +125C Military: -55C to +125C
Candidate List Date 2024-01-23 2018-01-15
SVHC Over MCV 7439-92-1
Conflict Mineral Status DRC Conflict Free DRC Conflict Free
Conflict Mineral Status Source CMRT V6.22 CMRT V6.31
Qualifications DLA
Capacitance 0.033 µF 0.033 µF
Capacitor Type CERAMIC CAPACITOR CERAMIC CAPACITOR
Dielectric Material CERAMIC CERAMIC
Height 1.295 mm 2.03 mm
JESD-609 Code e0 e3
Length 4.57 mm 4.57 mm
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Multilayer Yes Yes
Negative Tolerance 10% 10%
Number of Terminals 2 2
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Shape RECTANGULAR PACKAGE RECTANGULAR PACKAGE
Package Style SMT SMT
Packing Method TR, 7 INCH TR, EMBOSSED PLASTIC, 11.25/13 INCH
Positive Tolerance 10% 10%
Rated (DC) Voltage (URdc) 100 V 100 V
Reference Standard MIL-PRF-55681 MIL-PRF-55681/1
Size Code 1808 1808
Surface Mount YES YES
Temperature Characteristics Code BX BX
Temperature Coefficient 15% ppm/°C 15% ppm/°C
Terminal Finish Tin/Lead (Sn60Pb40) - with Nickel (Ni) barrier Matte Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape WRAPAROUND WRAPAROUND
Width 2.03 mm 2.03 mm
Base Number Matches 3 2
EFUP 50

Compare CDR03BX333BKSS with alternatives

Compare CDR03BX333BKWSAR with alternatives