CDR03BX333BKSS
vs
CDR03BX333BKWSAR
feature comparison
All Stats
Differences Only
Pbfree Code
No
Rohs Code
No
No
Part Life Cycle Code
Active
Not Recommended
parentfamilyid
1102607
Ihs Manufacturer
KEMET ELECTRONICS CORP
VISHAY INTERTECHNOLOGY INC
Package Description
, 1808
CHIP
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8532.24.00.20
8532.24.00.20
Factory Lead Time
18 Weeks
18 Weeks
Category CO2 Kg
3.7
3.59
Compliance Temperature Grade
Military: -55C to +125C
Military: -55C to +125C
Candidate List Date
2024-01-23
2018-01-15
SVHC Over MCV
7439-92-1
Conflict Mineral Status
DRC Conflict Free
DRC Conflict Free
Conflict Mineral Status Source
CMRT V6.22
CMRT V6.31
Qualifications
DLA
Capacitance
0.033 µF
0.033 µF
Capacitor Type
CERAMIC CAPACITOR
CERAMIC CAPACITOR
Dielectric Material
CERAMIC
CERAMIC
Height
1.295 mm
2.03 mm
JESD-609 Code
e0
e3
Length
4.57 mm
4.57 mm
Mounting Feature
SURFACE MOUNT
SURFACE MOUNT
Multilayer
Yes
Yes
Negative Tolerance
10%
10%
Number of Terminals
2
2
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Shape
RECTANGULAR PACKAGE
RECTANGULAR PACKAGE
Package Style
SMT
SMT
Packing Method
TR, 7 INCH
TR, EMBOSSED PLASTIC, 11.25/13 INCH
Positive Tolerance
10%
10%
Rated (DC) Voltage (URdc)
100 V
100 V
Reference Standard
MIL-PRF-55681
MIL-PRF-55681/1
Size Code
1808
1808
Surface Mount
YES
YES
Temperature Characteristics Code
BX
BX
Temperature Coefficient
15% ppm/°C
15% ppm/°C
Terminal Finish
Tin/Lead (Sn60Pb40) - with Nickel (Ni) barrier
Matte Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape
WRAPAROUND
WRAPAROUND
Width
2.03 mm
2.03 mm
Base Number Matches
3
2
EFUP
50
Compare CDR03BX333BKSS with alternatives
Compare CDR03BX333BKWSAR with alternatives