CDP1824CD3
vs
CDP1824CD3
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTERSIL CORP
HARRIS SEMICONDUCTOR
Part Package Code
DIP
Package Description
SIDE BRAZED, CERAMIC, DIP-18
DIP, DIP18,.3
Pin Count
18
Reach Compliance Code
not_compliant
unknown
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
825 ns
825 ns
JESD-30 Code
R-CDIP-T18
R-CDIP-T18
JESD-609 Code
e0
e0
Memory Density
256 bit
256 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
18
18
Number of Words
32 words
32 words
Number of Words Code
32
32
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
32X8
32X8
Output Characteristics
3-STATE
3-STATE
Output Enable
NO
NO
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
DIP
Package Equivalence Code
DIP18,.3
DIP18,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
38535Q/M;38534H;883B
38535Q/M;38534H;883B
Standby Current-Max
0.00004 A
0.00004 A
Standby Voltage-Min
2.5 V
2.5 V
Supply Current-Max
0.008 mA
0.008 mA
Supply Voltage-Max (Vsup)
6.5 V
6.5 V
Supply Voltage-Min (Vsup)
4 V
4 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
1
1