CDLL5306
vs
JANTXV1N5306UR-1
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
AEROFLEX/METELICS INC
Package Description
HERMETIC SEALED, GLASS, LL41, MELF-2
Reach Compliance Code
compliant
unknown
Factory Lead Time
21 Weeks
Additional Feature
METALLURGICALLY BONDED
METALLURGICALLY BONDED
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
CURRENT REGULATOR DIODE
CURRENT REGULATOR DIODE
Dynamic Impedance-Min
370000 Ω
JEDEC-95 Code
DO-213AB
DO-213AB
JESD-30 Code
O-LELF-R2
O-XELF-R2
JESD-609 Code
e0
e0
Limiting Voltage-Max
1.95 V
1.95 V
Number of Elements
1
1
Number of Terminals
2
2
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Power Dissipation-Max
0.5 W
0.5 W
Qualification Status
Not Qualified
Not Qualified
Regulation Current-Nom (Ireg)
2.2 mA
2.2 mA
Rep Pk Reverse Voltage-Max
100 V
Surface Mount
YES
YES
Technology
FIELD EFFECT
FIELD EFFECT
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
WRAP AROUND
WRAP AROUND
Terminal Position
END
END
Base Number Matches
1
1
ECCN Code
EAR99
HTS Code
8541.10.00.70
Operating Temperature-Max
175 °C
Operating Temperature-Min
-65 °C
Reference Standard
MIL-19500
Compare CDLL5306 with alternatives
Compare JANTXV1N5306UR-1 with alternatives