CDLL4760DE3 vs MX1N3040DUR-1E3 feature comparison

CDLL4760DE3 Microsemi Corporation

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MX1N3040DUR-1E3 Microsemi Corporation

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Package Description O-LELF-R2 O-LELF-R2
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Additional Feature METALLURGICALLY BONDED METALLURGICALLY BONDED, HIGH RELIABILITY
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JEDEC-95 Code DO-213AB DO-213AB
JESD-30 Code O-LELF-R2 O-LELF-R2
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 175 °C 175 °C
Operating Temperature-Min -65 °C -65 °C
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 1 W 1.25 W
Reference Voltage-Nom 68 V 68 V
Surface Mount YES YES
Technology ZENER ZENER
Terminal Form WRAP AROUND WRAP AROUND
Terminal Position END END
Voltage Tol-Max 1% 1%
Working Test Current 3.7 mA 3.7 mA
Base Number Matches 1 1
Rohs Code Yes
Part Package Code DO-213AB
Pin Count 2
JESD-609 Code e3
Qualification Status Not Qualified
Terminal Finish MATTE TIN

Compare CDLL4760DE3 with alternatives

Compare MX1N3040DUR-1E3 with alternatives