CDLL4684
vs
MMSZ4684T1
feature comparison
All Stats
Differences Only
Rohs Code
No
No
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
ON SEMICONDUCTOR
Package Description
HERMETIC SEALED, GLASS, SOD-80, LL34, MELF-2
R-PDSO-G2
Reach Compliance Code
compliant
not_compliant
Factory Lead Time
14 Weeks
Additional Feature
METALLURGICALLY BONDED
Case Connection
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JEDEC-95 Code
DO-213AA
JESD-30 Code
O-LELF-R2
R-PDSO-G2
JESD-609 Code
e0
e0
Number of Elements
1
1
Number of Terminals
2
2
Package Body Material
GLASS
PLASTIC/EPOXY
Package Shape
ROUND
RECTANGULAR
Package Style
LONG FORM
SMALL OUTLINE
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
0.5 W
Qualification Status
Not Qualified
Not Qualified
Reference Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
WRAP AROUND
GULL WING
Terminal Position
END
DUAL
Voltage Tol-Max
5%
5.15%
Working Test Current
0.05 mA
0.05 mA
Base Number Matches
3
3
Pbfree Code
No
Pin Count
2
Manufacturer Package Code
CASE 425-04
ECCN Code
EAR99
HTS Code
8541.10.00.50
Samacsys Manufacturer
onsemi
Moisture Sensitivity Level
1
Operating Temperature-Max
150 °C
Peak Reflow Temperature (Cel)
235
Reference Standard
UL RECOGNIZED
Time@Peak Reflow Temperature-Max (s)
30
Compare CDLL4684 with alternatives
Compare MMSZ4684T1 with alternatives