CDLL4577AE3
vs
JAN1N4577AUR-1
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
MICROSEMI CORP
MICROCHIP TECHNOLOGY INC
Package Description
O-LELF-R2
HERMETIC SEALED, GLASS, LL34, MELF-2
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
HTS Code
8541.10.00.50
Additional Feature
METALLURGICALLY BONDED
METALLURGICALLY BONDED
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JEDEC-95 Code
DO-213AA
DO-213AA
JESD-30 Code
O-LELF-R2
O-LELF-R2
Number of Elements
1
1
Number of Terminals
2
2
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Power Dissipation-Max
0.5 W
0.5 W
Reference Voltage-Nom
6.4 V
6.4 V
Surface Mount
YES
YES
Technology
ZENER
ZENER
Terminal Form
WRAP AROUND
WRAP AROUND
Terminal Position
END
END
Voltage Temp Coeff-Max
0.128 mV/°C
Voltage Tol-Max
5%
5%
Base Number Matches
1
8
Rohs Code
Factory Lead Time
26 Weeks
JESD-609 Code
e0
Polarity
UNIDIRECTIONAL
Qualification Status
Qualified
Reference Standard
MIL-19500/452
Terminal Finish
TIN LEAD
Working Test Current
2 mA
Compare CDLL4577AE3 with alternatives
Compare JAN1N4577AUR-1 with alternatives