CDLL4566A
vs
JAN1N4566AUR-1
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
COBHAM PLC
Package Description
HERMETIC SEALED, GLASS, LL34, MELF-2
HERMETIC SEALED, GLASS, LL34, MELF-2
Reach Compliance Code
compliant
unknown
Factory Lead Time
26 Weeks
Additional Feature
METALLURGICALLY BONDED
METALLURGICALLY BONDED
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JEDEC-95 Code
DO-213AA
DO-213AA
JESD-30 Code
O-LELF-R2
O-LELF-R2
JESD-609 Code
e0
e0
Number of Elements
1
1
Number of Terminals
2
2
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
0.5 W
Qualification Status
Not Qualified
Not Qualified
Reference Voltage-Nom
6.4 V
6.4 V
Surface Mount
YES
YES
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
WRAP AROUND
WRAP AROUND
Terminal Position
END
END
Voltage Temp Coeff-Max
0.32 mV/°C
0.32 mV/°C
Voltage Tol-Max
5%
5%
Working Test Current
0.5 mA
Base Number Matches
3
8
ECCN Code
EAR99
HTS Code
8541.10.00.50
Reference Standard
MIL-19500/452
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