CDF080560R40.5%100PPM/KKS Microtech GmbH ElectronicBuy Now Datasheet |
MC0805-60R4-DBQ RCD Components IncBuy Now Datasheet |
| Rohs Code | Yes | No |
|---|---|---|
| Part Life Cycle Code | Active | Active |
| Ihs Manufacturer | MICROTECH GMBH ELECTRONIC | RCD COMPONENTS INC |
| Reach Compliance Code | compliant | compliant |
| ECCN Code | EAR99 | EAR99 |
| Construction | Chip | Rectangular |
| JESD-609 Code | e3 | e0 |
| Number of Terminals | 2 | 2 |
| Operating Temperature-Max | 155 °C | 155 °C |
| Operating Temperature-Min | -55 °C | -55 °C |
| Package Height | 0.5 mm | 0.5 mm |
| Package Length | 2 mm | 2 mm |
| Package Style | SMT | SMT |
| Package Width | 1.25 mm | 1.25 mm |
| Packing Method | Bulk | Bulk |
| Rated Power Dissipation (P) | 0.125 W | 0.125 W |
| Resistance | 60.4 Ω | 60.4 Ω |
| Resistor Type | FIXED RESISTOR | FIXED RESISTOR |
| Size Code | 0805 | 0805 |
| Technology | METAL GLAZE/THICK FILM | METAL GLAZE/THICK FILM |
| Temperature Coefficient | 100 ppm/°C | 100 ppm/°C |
| Terminal Finish | Tin (Sn) - with Nickel (Ni) barrier | Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier |
| Tolerance | 0.5% | 0.5% |
| Working Voltage | 150 V | 150 V |
| Base Number Matches | 1 | 1 |
| Package Description | CHIP | |
| HTS Code | 8533.21.00.30 | |
| Mounting Feature | SURFACE MOUNT | |
| Rated Temperature | 70 °C | |
| Surface Mount | YES | |
| Terminal Shape | WRAPAROUND | |