CDCU877RTB vs ICS97ULP877BHLF-T feature comparison

CDCU877RTB Texas Instruments

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ICS97ULP877BHLF-T Integrated Device Technology Inc

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer TEXAS INSTRUMENTS INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code QFN BGA
Package Description HVQCCN, LCC40,.24SQ,20 LEAD FREE ANNEALED, MO-205, MO-225, BGA-52
Pin Count 40 52
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family 877 97ULP
Input Conditioning DIFFERENTIAL DIFFERENTIAL
JESD-30 Code S-PQCC-N40 R-PBGA-B52
JESD-609 Code e0 e1
Length 6 mm 7 mm
Logic IC Type PLL BASED CLOCK DRIVER PLL BASED CLOCK DRIVER
Max I(ol) 0.009 A
Number of Functions 1 1
Number of Inverted Outputs
Number of Terminals 40 52
Number of True Outputs 10 10
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HVQCCN VFBGA
Package Equivalence Code LCC40,.24SQ,20 BGA52,6X10,25
Package Shape SQUARE RECTANGULAR
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Same Edge Skew-Max (tskwd) 0.035 ns 0.04 ns
Seated Height-Max 0.9 mm 1 mm
Supply Voltage-Max (Vsup) 1.9 V 1.9 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN LEAD Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form NO LEAD BALL
Terminal Pitch 0.5 mm 0.65 mm
Terminal Position QUAD BOTTOM
Width 6 mm 5.5 mm
fmax-Min 340 MHz 410 MHz
Base Number Matches 3 1
Pbfree Code Yes
Rohs Code Yes
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30

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