CDCU877RHA
vs
CDCU877RTBT
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
Part Package Code |
QFN
|
QFN
|
Package Description |
HVQCCN, LCC40,.24SQ,20
|
6 X 6 MM, 0.50 MM PITCH, PLASTIC, QFN-40
|
Pin Count |
40
|
40
|
Reach Compliance Code |
unknown
|
not_compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
877
|
877
|
Input Conditioning |
DIFFERENTIAL
|
DIFFERENTIAL
|
JESD-30 Code |
S-PQCC-N40
|
S-PQCC-N40
|
JESD-609 Code |
e4
|
|
Length |
6 mm
|
6 mm
|
Logic IC Type |
PLL BASED CLOCK DRIVER
|
PLL BASED CLOCK DRIVER
|
Max I(ol) |
0.009 A
|
0.009 A
|
Number of Functions |
1
|
1
|
Number of Inverted Outputs |
|
|
Number of Terminals |
40
|
40
|
Number of True Outputs |
10
|
10
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Characteristics |
3-STATE
|
3-STATE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HVQCCN
|
HVQCCN
|
Package Equivalence Code |
LCC40,.24SQ,20
|
LCC40,.24SQ,20
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Same Edge Skew-Max (tskwd) |
0.035 ns
|
0.035 ns
|
Seated Height-Max |
1 mm
|
0.9 mm
|
Supply Voltage-Max (Vsup) |
1.9 V
|
1.9 V
|
Supply Voltage-Min (Vsup) |
1.7 V
|
1.7 V
|
Supply Voltage-Nom (Vsup) |
1.8 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
6 mm
|
6 mm
|
fmax-Min |
340 MHz
|
340 MHz
|
Base Number Matches |
5
|
1
|
Pbfree Code |
|
No
|
Rohs Code |
|
No
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Technology |
|
CMOS
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare CDCU877RHA with alternatives
Compare CDCU877RTBT with alternatives