CD973BE3 vs JAN1N973B-1 feature comparison

CD973BE3 Microsemi Corporation

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JAN1N973B-1 Compensated Devices Inc

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MICROSEMI CORP COMPENSATED DEVICES INC
Package Description S-XXUC-N2 HERMETIC SEALED, GLASS PACKAGE-1
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8541.10.00.50
Category CO2 Kg 8.7 8.7
Compliance Temperature Grade Military: -65C to +175C Military: -65C to +175C
Candidate List Date 2017-07-07
Conflict Mineral Status DRC Conflict Free
Conflict Mineral Status Source CMRT V5.10
Case Connection CATHODE ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JESD-30 Code S-XUUC-N1 O-LALF-W2
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 175 °C 175 °C
Operating Temperature-Min -65 °C -65 °C
Package Body Material UNSPECIFIED GLASS
Package Shape SQUARE ROUND
Package Style UNCASED CHIP LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.5 W 0.5 W
Reference Voltage-Nom 33 V 33 V
Surface Mount YES NO
Technology ZENER ZENER
Terminal Form NO LEAD WIRE
Terminal Position UNSPECIFIED AXIAL
Voltage Tol-Max 5% 5%
Working Test Current 3.8 mA 3.8 mA
Base Number Matches 1 9
Additional Feature METALLURGICALLY BONDED
JEDEC-95 Code DO-35
Knee Impedance-Max 1000 Ω
Qualification Status Not Qualified
Reference Standard MIL-19500/117
Reverse Current-Max 0.5 µA

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