CD973BE3
vs
JAN1N973B-1
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
MICROSEMI CORP
COMPENSATED DEVICES INC
Package Description
S-XXUC-N2
HERMETIC SEALED, GLASS PACKAGE-1
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
HTS Code
8541.10.00.50
Category CO2 Kg
8.7
8.7
Compliance Temperature Grade
Military: -65C to +175C
Military: -65C to +175C
Candidate List Date
2017-07-07
Conflict Mineral Status
DRC Conflict Free
Conflict Mineral Status Source
CMRT V5.10
Case Connection
CATHODE
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JESD-30 Code
S-XUUC-N1
O-LALF-W2
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
175 °C
Operating Temperature-Min
-65 °C
-65 °C
Package Body Material
UNSPECIFIED
GLASS
Package Shape
SQUARE
ROUND
Package Style
UNCASED CHIP
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
0.5 W
Reference Voltage-Nom
33 V
33 V
Surface Mount
YES
NO
Technology
ZENER
ZENER
Terminal Form
NO LEAD
WIRE
Terminal Position
UNSPECIFIED
AXIAL
Voltage Tol-Max
5%
5%
Working Test Current
3.8 mA
3.8 mA
Base Number Matches
1
9
Additional Feature
METALLURGICALLY BONDED
JEDEC-95 Code
DO-35
Knee Impedance-Max
1000 Ω
Qualification Status
Not Qualified
Reference Standard
MIL-19500/117
Reverse Current-Max
0.5 µA
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