CD968B
vs
MSP1N5745-1TR
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
COBHAM PLC
MICROSEMI CORP
Package Description
DIE-1
O-LALF-W2
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JESD-30 Code
S-XUUC-N1
O-LALF-W2
Number of Elements
1
1
Number of Terminals
1
2
Operating Temperature-Max
175 °C
175 °C
Operating Temperature-Min
-65 °C
-65 °C
Package Body Material
UNSPECIFIED
GLASS
Package Shape
SQUARE
ROUND
Package Style
UNCASED CHIP
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Reference Voltage-Nom
20 V
24 V
Surface Mount
YES
NO
Technology
ZENER
ZENER
Terminal Form
NO LEAD
WIRE
Terminal Position
UPPER
AXIAL
Voltage Tol-Max
5%
20%
Working Test Current
6.2 mA
5 mA
Base Number Matches
7
1
Rohs Code
Part Package Code
DO-35
Pin Count
2
Case Connection
ISOLATED
JEDEC-95 Code
DO-204AH
JESD-609 Code
e0
Moisture Sensitivity Level
1
Power Dissipation-Max
0.48 W
Qualification Status
Not Qualified
Terminal Finish
TIN LEAD
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