CD757C vs CD5239C feature comparison

CD757C Microsemi Corporation

Buy Now Datasheet

CD5239C Microsemi Corporation

Buy Now Datasheet
Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Part Package Code DIE DIE
Package Description DIE-2 DIE-2
Pin Count 2 2
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Case Connection CATHODE
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JESD-30 Code S-XXUC-N2 S-XUUC-N1
JESD-609 Code e0 e0
Number of Elements 1 1
Number of Terminals 2 1
Package Body Material UNSPECIFIED UNSPECIFIED
Package Shape SQUARE SQUARE
Package Style UNCASED CHIP UNCASED CHIP
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.5 W 0.5 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 9.1 V 9.1 V
Surface Mount YES YES
Technology ZENER ZENER
Terminal Finish TIN LEAD TIN LEAD
Terminal Form NO LEAD NO LEAD
Terminal Position UNSPECIFIED UPPER
Voltage Tol-Max 2% 2%
Working Test Current 20 mA 20 mA
Base Number Matches 7 6
Dynamic Impedance-Max 10 Ω
Operating Temperature-Max 175 °C

Compare CD757C with alternatives

Compare CD5239C with alternatives