CD74HCT74EX
vs
MC74HCT74AN
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Contact Manufacturer
Transferred
Ihs Manufacturer
ROCHESTER ELECTRONICS LLC
MOTOROLA INC
Package Description
,
DIP, DIP14,.3
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
HCT
HCT
JESD-30 Code
R-PDIP-T14
R-PDIP-T14
JESD-609 Code
e0
e0
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Number of Bits
1
1
Number of Functions
2
2
Number of Terminals
14
14
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Output Polarity
COMPLEMENTARY
COMPLEMENTARY
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Base Number Matches
4
5
Part Package Code
DIP
Pin Count
14
Length
18.86 mm
Load Capacitance (CL)
50 pF
Max Frequency@Nom-Sup
20000000 Hz
Max I(ol)
0.004 A
Package Equivalence Code
DIP14,.3
Propagation Delay (tpd)
36 ns
Seated Height-Max
4.69 mm
Terminal Pitch
2.54 mm
Width
7.62 mm
fmax-Min
20 MHz
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