CD74HCT4052M96G4
vs
74HCT4052DB,118
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
NXP SEMICONDUCTORS
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Base Number Matches |
2
|
2
|
| Part Package Code |
|
SSOP1
|
| Package Description |
|
5.30 MM, PLASTIC, MO-150, SOT-338-1, SSOP-16
|
| Pin Count |
|
16
|
| Manufacturer Package Code |
|
SOT338-1
|
| Analog IC - Other Type |
|
DIFFERENTIAL MULTIPLEXER
|
| JESD-30 Code |
|
R-PDSO-G16
|
| JESD-609 Code |
|
e4
|
| Length |
|
6.2 mm
|
| Moisture Sensitivity Level |
|
1
|
| Neg Supply Voltage-Max (Vsup) |
|
-5 V
|
| Neg Supply Voltage-Min (Vsup) |
|
-1 V
|
| Neg Supply Voltage-Nom (Vsup) |
|
-4.5 V
|
| Normal Position |
|
NO
|
| Number of Channels |
|
4
|
| Number of Functions |
|
1
|
| Number of Terminals |
|
16
|
| Off-state Isolation-Nom |
|
50 dB
|
| On-state Resistance Match-Nom |
|
6 Ω
|
| On-state Resistance-Max (Ron) |
|
195 Ω
|
| Operating Temperature-Max |
|
125 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
SSOP
|
| Package Equivalence Code |
|
SSOP16,.3
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
SMALL OUTLINE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
2 mm
|
| Signal Current-Max |
|
0.025 A
|
| Supply Current-Max (Isup) |
|
0.32 mA
|
| Supply Voltage-Max (Vsup) |
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
|
5 V
|
| Surface Mount |
|
YES
|
| Switch-off Time-Max |
|
57 ns
|
| Switch-on Time-Max |
|
72 ns
|
| Switching |
|
BREAK-BEFORE-MAKE
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
AUTOMOTIVE
|
| Terminal Finish |
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
0.65 mm
|
| Terminal Position |
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
| Width |
|
5.3 mm
|
|
|
|
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