CD74HCT40105E
vs
N74F224N
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
NXP SEMICONDUCTORS
|
| Part Package Code |
DIP
|
DIP
|
| Package Description |
DIP-16
|
DIP,
|
| Pin Count |
16
|
16
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.32.00.71
|
| Samacsys Manufacturer |
Texas Instruments
|
|
| Access Time-Max |
2250 ns
|
|
| Clock Frequency-Max (fCLK) |
10 MHz
|
|
| Cycle Time |
100 ns
|
|
| JESD-30 Code |
R-PDIP-T16
|
R-PDIP-T16
|
| JESD-609 Code |
e4
|
|
| Length |
19.305 mm
|
19.09 mm
|
| Memory Density |
64 bit
|
64 bit
|
| Memory IC Type |
OTHER FIFO
|
|
| Memory Width |
4
|
4
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Number of Words |
16 words
|
16 words
|
| Number of Words Code |
16
|
16
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
125 °C
|
70 °C
|
| Operating Temperature-Min |
-55 °C
|
|
| Organization |
16X4
|
16X4
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Enable |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP16,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.08 mm
|
4.06 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
TTL
|
| Temperature Grade |
MILITARY
|
COMMERCIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
7.62 mm
|
| Base Number Matches |
2
|
1
|
|
|
|
Compare CD74HCT40105E with alternatives
Compare N74F224N with alternatives