CD74HCT373MG4
vs
M38510/65453SSX
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
Part Package Code |
SOIC
|
DFP
|
Package Description |
SOIC-20
|
DFP,
|
Pin Count |
20
|
20
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Control Type |
ENABLE LOW
|
|
Count Direction |
UNIDIRECTIONAL
|
|
Family |
HCT
|
HCT
|
JESD-30 Code |
R-PDSO-G20
|
R-XDFP-F20
|
JESD-609 Code |
e4
|
|
Length |
12.8 mm
|
|
Load Capacitance (CL) |
50 pF
|
|
Logic IC Type |
BUS DRIVER
|
BUS DRIVER
|
Max I(ol) |
0.006 A
|
|
Moisture Sensitivity Level |
1
|
|
Number of Bits |
8
|
1
|
Number of Functions |
1
|
1
|
Number of Ports |
2
|
2
|
Number of Terminals |
20
|
20
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Output Characteristics |
3-STATE
|
3-STATE
|
Output Polarity |
TRUE
|
TRUE
|
Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
Package Code |
SOP
|
DFP
|
Package Equivalence Code |
SOP20,.4
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
FLATPACK
|
Packing Method |
TUBE
|
|
Peak Reflow Temperature (Cel) |
260
|
|
Power Supply Current-Max (ICC) |
0.08 mA
|
|
Prop. Delay@Nom-Sup |
48 ns
|
|
Propagation Delay (tpd) |
53 ns
|
41 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.65 mm
|
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
MILITARY
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
Terminal Form |
GULL WING
|
FLAT
|
Terminal Pitch |
1.27 mm
|
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
7.5 mm
|
|
Base Number Matches |
1
|
1
|
|
|
|
Compare CD74HCT373MG4 with alternatives
Compare M38510/65453SSX with alternatives