CD74HCT162EX
vs
M74HCT162M1R
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
HARRIS SEMICONDUCTOR
STMICROELECTRONICS
Package Description
DIP, DIP16,.3
SO-16
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
TCO OUTPUT
TCO OUTPUT
Count Direction
UP
UP
Family
HCT
HCT
JESD-30 Code
R-PDIP-T16
R-PDSO-G16
JESD-609 Code
e0
e4
Load Capacitance (CL)
50 pF
50 pF
Load/Preset Input
YES
YES
Logic IC Type
DECADE COUNTER
DECADE COUNTER
Max Frequency@Nom-Sup
24000000 Hz
21000000 Hz
Max I(ol)
0.004 A
0.004 A
Mode of Operation
SYNCHRONOUS
SYNCHRONOUS
Number of Bits
4
4
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
SOP
Package Equivalence Code
DIP16,.3
SOP16,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
NICKEL PALLADIUM GOLD
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
DUAL
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Base Number Matches
1
1
Pbfree Code
Part Package Code
SOIC
Pin Count
16
Length
9.9 mm
Moisture Sensitivity Level
3
Packing Method
TUBE
Propagation Delay (tpd)
54 ns
Seated Height-Max
1.75 mm
Width
3.9 mm
fmax-Min
21 MHz
Compare CD74HCT162EX with alternatives
Compare M74HCT162M1R with alternatives