CD74HCT123EX vs GD74HCT123 feature comparison

CD74HCT123EX Intersil Corporation

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GD74HCT123 LG Semicon Co Ltd

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTERSIL CORP LG SEMICON CO LTD
Package Description DIP-16 DIP, DIP16,.3
Reach Compliance Code not_compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDIP-T16 R-PDIP-T16
JESD-609 Code e0 e0
Logic IC Type MONOSTABLE MULTIVIBRATOR MONOSTABLE MULTIVIBRATOR
Number of Terminals 16 16
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP16,.3 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 4 2
Qualification Status Not Qualified