CD74HC688EX vs 5962-8681801RA feature comparison

CD74HC688EX Harris Semiconductor

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5962-8681801RA Texas Instruments

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Rohs Code No No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer HARRIS SEMICONDUCTOR TEXAS INSTRUMENTS INC
Package Description DIP-20 DIP, DIP20,.3
Reach Compliance Code unknown not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature CASCADABLE
Family HC/UH HC/UH
JESD-30 Code R-PDIP-T20 R-GDIP-T20
JESD-609 Code e0 e0
Logic IC Type IDENTITY COMPARATOR IDENTITY COMPARATOR
Number of Bits 8 8
Number of Functions 1 8
Number of Terminals 20 20
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Output Polarity INVERTED INVERTED
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP20,.3 DIP20,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Qualified
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 1 1
Pbfree Code Yes
Part Package Code DIP
Pin Count 20
ECCN Code EAR99
Length 24.195 mm
Load Capacitance (CL) 50 pF
Max I(ol) 0.0052 A
Packing Method TUBE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Power Supply Current-Max (ICC) 0.08 mA
Prop. Delay@Nom-Sup 45 ns
Propagation Delay (tpd) 313 ns
Screening Level MIL-STD-883
Seated Height-Max 5.08 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm

Compare CD74HC688EX with alternatives

Compare 5962-8681801RA with alternatives