CD74HC423M96G4 vs HEF4538BPB feature comparison

CD74HC423M96G4 Texas Instruments

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HEF4538BPB NXP Semiconductors

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC NXP SEMICONDUCTORS
Part Package Code SOIC DIP
Package Description SOP, SOP16,.25 DIP,
Pin Count 16 16
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Texas Instruments
Additional Feature RETRIGGERABLE RETRIGGERABLE
Family HC/UH 4000/14000/40000
JESD-30 Code R-PDSO-G16 R-PDIP-T16
JESD-609 Code e4
Length 9.9 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type MONOSTABLE MULTIVIBRATOR MONOSTABLE MULTIVIBRATOR
Max I(ol) 0.0052 A
Moisture Sensitivity Level 1
Number of Bits 2
Number of Data/Clock Inputs 2 2
Number of Functions 2 2
Number of Terminals 16 16
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP DIP
Package Equivalence Code SOP16,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Packing Method TR
Peak Reflow Temperature (Cel) 260
Power Supply Current-Max (ICC) 0.08 mA
Propagation Delay (tpd) 480 ns 460 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 4.7 mm
Supply Voltage-Max (Vsup) 6 V 15 V
Supply Voltage-Min (Vsup) 2 V 3 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 3.9 mm 7.62 mm
Base Number Matches 1 1

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