CD74HC283M96E4
vs
TC74HC283AFN-TP2ELP
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TOSHIBA CORP
|
Part Package Code |
SOIC
|
SOIC
|
Package Description |
SOP, SOP16,.25
|
SOP,
|
Pin Count |
16
|
16
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Texas Instruments
|
|
Additional Feature |
WITH FULL INTERNAL LOOKAHEAD
|
FULL ADDER; WITH INTERNAL CARRY LOOKAHEAD; PERMITS RIPPLE CARRY CASCADING
|
Family |
HC/UH
|
HC/UH
|
JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G16
|
JESD-609 Code |
e4
|
|
Length |
9.9 mm
|
9.9 mm
|
Logic IC Type |
ADDER/SUBTRACTOR
|
ADDER/SUBTRACTOR
|
Moisture Sensitivity Level |
1
|
|
Number of Bits |
4
|
4
|
Number of Functions |
1
|
1
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-55 °C
|
-40 °C
|
Output Polarity |
TRUE
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
SOP
|
Package Equivalence Code |
SOP16,.25
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
260
|
|
Propagation Delay (tpd) |
315 ns
|
53 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.75 mm
|
1.75 mm
|
Supply Voltage-Max (Vsup) |
6 V
|
6 V
|
Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
Supply Voltage-Nom (Vsup) |
4.5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
INDUSTRIAL
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
3.9 mm
|
3.9 mm
|
Base Number Matches |
1
|
1
|
Load Capacitance (CL) |
|
50 pF
|
|
|
|
Compare CD74HC283M96E4 with alternatives
Compare TC74HC283AFN-TP2ELP with alternatives