CD74HC253M96E4
vs
CD54AC257H
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
Rohs Code
Yes
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TEXAS INSTRUMENTS INC
HARRIS SEMICONDUCTOR
Part Package Code
SOIC
Package Description
SOP,
DIE,
Pin Count
16
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
HC/UH
AC
JESD-30 Code
R-PDSO-G16
X-XUUC-N16
JESD-609 Code
e4
Length
9.9 mm
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Moisture Sensitivity Level
1
Number of Functions
2
4
Number of Inputs
4
2
Number of Outputs
1
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
SOP
DIE
Package Shape
RECTANGULAR
UNSPECIFIED
Package Style
SMALL OUTLINE
UNCASED CHIP
Propagation Delay (tpd)
265 ns
13.4 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
Supply Voltage-Max (Vsup)
6 V
5.5 V
Supply Voltage-Min (Vsup)
2 V
1.5 V
Supply Voltage-Nom (Vsup)
4.5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
NICKEL PALLADIUM GOLD
Terminal Form
GULL WING
NO LEAD
Terminal Pitch
1.27 mm
Terminal Position
DUAL
UPPER
Width
3.9 mm
Base Number Matches
1
2
Load Capacitance (CL)
50 pF
Package Equivalence Code
DIE OR CHIP
Compare CD74HC253M96E4 with alternatives
Compare CD54AC257H with alternatives