CD74HC238EX vs CD74HC238MTG4 feature comparison

CD74HC238EX Harris Semiconductor

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CD74HC238MTG4 Texas Instruments

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer HARRIS SEMICONDUCTOR TEXAS INSTRUMENTS INC
Package Description DIP, DIP16,.3 SOP, SOP16,.25
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature 3 ENABLE INPUTS TWO ACTIVE LOW AND ONE ACTIVE HIGH ENABLE INPUTS
Family HC/UH HC/UH
Input Conditioning STANDARD STANDARD
JESD-30 Code R-PDIP-T16 R-PDSO-G16
JESD-609 Code e0 e4
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type 3-LINE TO 8-LINE DECODER 3-LINE TO 8-LINE DECODER
Max I(ol) 0.004 A 0.004 A
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP16,.3 SOP16,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Prop. Delay@Nom-Sup 45 ns 45 ns
Propagation Delay (tpd) 225 ns 225 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 4.5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD NICKEL PALLADIUM GOLD
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Base Number Matches 1 1
Pbfree Code Yes
Part Package Code SOIC
Pin Count 16
Length 9.9 mm
Moisture Sensitivity Level 1
Packing Method TR
Peak Reflow Temperature (Cel) 260
Seated Height-Max 1.75 mm
Time@Peak Reflow Temperature-Max (s) 30
Width 3.9 mm

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Compare CD74HC238MTG4 with alternatives