CD74HC175M96
vs
MC74HC175ADG
feature comparison
All Stats
Differences Only
Rohs Code
No
Part Life Cycle Code
Transferred
Contact Manufacturer
Ihs Manufacturer
HARRIS SEMICONDUCTOR
ROCHESTER ELECTRONICS LLC
Package Description
SOIC-16
HALOGENE FREE AND ROHS COMPLIANT, SOIC-16
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
HC/UH
HC/UH
JESD-30 Code
R-PDSO-G16
R-PDSO-G16
JESD-609 Code
e0
e3
Length
9.9 mm
9.9 mm
Load Capacitance (CL)
50 pF
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Max Frequency@Nom-Sup
20000000 Hz
Max I(ol)
0.004 A
Number of Bits
4
1
Number of Functions
1
4
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Output Polarity
COMPLEMENTARY
COMPLEMENTARY
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Equivalence Code
SOP16,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Packing Method
TR
Propagation Delay (tpd)
53 ns
225 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
1.75 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
MATTE TIN
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
3.9 mm
3.9 mm
fmax-Min
20 MHz
24 MHz
Base Number Matches
5
2
Pbfree Code
Yes
Part Package Code
SOIC
Pin Count
16
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
40
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