CD74HC139MG4 vs TC74HC139AP feature comparison

CD74HC139MG4 Texas Instruments

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TC74HC139AP Toshiba America Electronic Components

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC TOSHIBA CORP
Part Package Code SOIC DIP
Package Description SOP, SOP16,.25 DIP, DIP16,.3
Pin Count 16 16
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Texas Instruments
Family HC/UH HC/UH
Input Conditioning STANDARD STANDARD
JESD-30 Code R-PDSO-G16 R-PDIP-T16
JESD-609 Code e4
Length 9.9 mm 19.25 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type 2-LINE TO 4-LINE DECODER 2-LINE TO 4-LINE DECODER
Max I(ol) 0.004 A 0.004 A
Moisture Sensitivity Level 1
Number of Functions 2 2
Number of Terminals 16 16
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Output Polarity INVERTED INVERTED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP DIP
Package Equivalence Code SOP16,.25 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Prop. Delay@Nom-Sup 44 ns 33 ns
Propagation Delay (tpd) 220 ns 165 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 4.45 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 4.5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish NICKEL PALLADIUM GOLD
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Width 3.9 mm 7.62 mm
Base Number Matches 1 2
Pbfree Code No

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