CD74ACT257M96G4
vs
5962H9655302VXX
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
AEROFLEX COLORADO SPRINGS
|
Part Package Code |
SOIC
|
DFP
|
Package Description |
SOP, SOP16,.25
|
DFP,
|
Pin Count |
16
|
16
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
ACT
|
ACT
|
JESD-30 Code |
R-PDSO-G16
|
R-CDFP-F16
|
JESD-609 Code |
e4
|
|
Length |
9.9 mm
|
|
Load Capacitance (CL) |
50 pF
|
|
Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
Max I(ol) |
0.024 A
|
|
Moisture Sensitivity Level |
1
|
|
Number of Functions |
4
|
4
|
Number of Inputs |
2
|
2
|
Number of Outputs |
1
|
1
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Output Characteristics |
3-STATE
|
|
Output Polarity |
TRUE
|
TRUE
|
Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
SOP
|
DFP
|
Package Equivalence Code |
SOP16,.25
|
FL16,.3
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
FLATPACK
|
Packing Method |
TR
|
|
Peak Reflow Temperature (Cel) |
260
|
|
Prop. Delay@Nom-Sup |
10.7 ns
|
|
Propagation Delay (tpd) |
10.7 ns
|
20 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.75 mm
|
2.921 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
3 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
MILITARY
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
Terminal Form |
GULL WING
|
FLAT
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
3.9 mm
|
|
Base Number Matches |
1
|
2
|
Screening Level |
|
MIL-PRF-38535 Class V
|
Total Dose |
|
1M Rad(Si) V
|
|
|
|
Compare CD74ACT257M96G4 with alternatives
Compare 5962H9655302VXX with alternatives