CD74ACT109MX vs TC74ACT109FN(ELP) feature comparison

CD74ACT109MX Ge Solid State

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TC74ACT109FN(ELP) Toshiba America Electronic Components

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer GE SOLID STATE TOSHIBA CORP
Package Description , 0.150 INCH, PLASTIC, SOIC-16
Reach Compliance Code unknown unknown
Family ACT ACT
JESD-30 Code R-PDSO-G16 R-PDSO-G16
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type J-KBAR FLIP-FLOP J-KBAR FLIP-FLOP
Number of Bits 2 2
Number of Functions 2 2
Number of Terminals 16 16
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Propagation Delay (tpd) 10.3 ns 11.4 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
fmax-Min 100 MHz 85 MHz
Base Number Matches 2 1
Part Package Code SOIC
Pin Count 16
Additional Feature 50 OHM LINE DRIVE CAPABILITY FOR < = 10MS ONE O/P AT A TIME
Length 9.9 mm
Seated Height-Max 1.75 mm
Terminal Pitch 1.27 mm
Width 3.9 mm

Compare CD74ACT109MX with alternatives

Compare TC74ACT109FN(ELP) with alternatives