CD74AC253EX vs 5962R9655001VEA feature comparison

CD74AC253EX Ge Solid State

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5962R9655001VEA Cobham Semiconductor Solutions

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer GE SOLID STATE AEROFLEX COLORADO SPRINGS
Package Description , DIP,
Reach Compliance Code unknown unknown
Family AC AC
JESD-30 Code R-PDIP-T16 R-CDIP-T16
Load Capacitance (CL) 50 pF
Logic IC Type MULTIPLEXER MULTIPLEXER
Number of Functions 2 2
Number of Inputs 4 4
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Output Characteristics 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 20 ns 16 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 3 1
Part Package Code DIP
Pin Count 16
HTS Code 8542.39.00.01
JESD-609 Code e0
Length 19.05 mm
Seated Height-Max 5.08 mm
Terminal Finish TIN LEAD
Terminal Pitch 2.54 mm
Total Dose 100k Rad(Si) V
Width 7.62 mm

Compare CD74AC253EX with alternatives

Compare 5962R9655001VEA with alternatives