CD74AC251M96E4
vs
CD74AC251M96
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
HARRIS SEMICONDUCTOR
|
Part Package Code |
SOIC
|
|
Package Description |
SOP, SOP16,.25
|
|
Pin Count |
16
|
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
AC
|
AC
|
JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G16
|
JESD-609 Code |
e4
|
e0
|
Length |
9.9 mm
|
|
Load Capacitance (CL) |
50 pF
|
50 pF
|
Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
Max I(ol) |
0.024 A
|
0.012 A
|
Moisture Sensitivity Level |
1
|
|
Number of Bits |
8
|
|
Number of Functions |
1
|
1
|
Number of Inputs |
8
|
8
|
Number of Outputs |
1
|
1
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Output Characteristics |
3-STATE
|
3-STATE
|
Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
SOP
|
Package Equivalence Code |
SOP16,.25
|
SOP16,.25
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Packing Method |
TR
|
TR
|
Peak Reflow Temperature (Cel) |
260
|
|
Power Supply Current-Max (ICC) |
0.16 mA
|
|
Prop. Delay@Nom-Sup |
20.9 ns
|
20.9 ns
|
Propagation Delay (tpd) |
186 ns
|
18.2 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.75 mm
|
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
1.5 V
|
1.5 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
MILITARY
|
Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Width |
3.9 mm
|
|
Base Number Matches |
1
|
3
|
|
|
|
Compare CD74AC251M96E4 with alternatives