CD74AC244EX vs TC74AC244P feature comparison

CD74AC244EX Harris Semiconductor

Buy Now Datasheet

TC74AC244P Toshiba America Electronic Components

Buy Now Datasheet
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer HARRIS SEMICONDUCTOR TOSHIBA CORP
Package Description DIP, DIP20,.3 DIP, DIP20,.3
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01
Control Type ENABLE LOW ENABLE LOW
Family AC AC
JESD-30 Code R-PDIP-T20 R-PDIP-T20
JESD-609 Code e0
Logic IC Type BUS DRIVER BUS DRIVER
Max I(ol) 0.012 A 0.075 A
Number of Bits 4 4
Number of Functions 2 2
Number of Ports 2 2
Number of Terminals 20 20
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP20,.3 DIP20,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Prop. Delay@Nom-Sup 11.5 ns 13 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.5 V 2 V
Supply Voltage-Nom (Vsup) 5 V 3 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 3 1
Part Package Code DIP
Pin Count 20
Count Direction UNIDIRECTIONAL
Length 24.6 mm
Load Capacitance (CL) 50 pF
Peak Reflow Temperature (Cel) NOT SPECIFIED
Power Supply Current-Max (ICC) 200 mA
Propagation Delay (tpd) 13 ns
Seated Height-Max 4.45 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm

Compare CD74AC244EX with alternatives

Compare TC74AC244P with alternatives