CD74AC175EX vs TC74HC76AF-EL feature comparison

CD74AC175EX Ge Solid State

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TC74HC76AF-EL Toshiba America Electronic Components

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer GE SOLID STATE TOSHIBA CORP
Package Description , SOP,
Reach Compliance Code unknown unknown
Family AC HC/UH
JESD-30 Code R-PDIP-T16 R-PDSO-G16
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type D FLIP-FLOP J-K FLIP-FLOP
Number of Functions 1 2
Number of Terminals 16 16
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Propagation Delay (tpd) 12.2 ns 31 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 6 V
Supply Voltage-Min (Vsup) 1.5 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Form THROUGH-HOLE GULL WING
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE NEGATIVE EDGE
fmax-Min 100 MHz 25 MHz
Base Number Matches 1 2
Pbfree Code No
Rohs Code No
Part Package Code SOIC
Pin Count 16
HTS Code 8542.39.00.01
Length 10.3 mm
Number of Bits 2
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 1.9 mm
Terminal Pitch 1.27 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 5.3 mm

Compare CD74AC175EX with alternatives

Compare TC74HC76AF-EL with alternatives