CD5543BE3
vs
JANTXV1N5543B-1
feature comparison
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
MICROSEMI CORP
|
M/A-COM TECHNOLOGY SOLUTIONS INC
|
Package Description |
S-XXUC-N2
|
HERMETIC SEALED PACKAGE-2
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.50
|
8541.10.00.50
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
ZENER DIODE
|
ZENER DIODE
|
JESD-30 Code |
S-XUUC-N1
|
O-PALF-W2
|
Number of Elements |
1
|
1
|
Number of Terminals |
1
|
2
|
Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
Package Shape |
SQUARE
|
ROUND
|
Package Style |
UNCASED CHIP
|
LONG FORM
|
Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
Power Dissipation-Max |
0.5 W
|
0.5 W
|
Reference Voltage-Nom |
25 V
|
25 V
|
Surface Mount |
YES
|
NO
|
Technology |
ZENER
|
ZENER
|
Terminal Form |
NO LEAD
|
WIRE
|
Terminal Position |
UPPER
|
AXIAL
|
Voltage Tol-Max |
5%
|
5%
|
Working Test Current |
1 mA
|
0.001 mA
|
Base Number Matches |
1
|
10
|
Case Connection |
|
ISOLATED
|
JEDEC-95 Code |
|
DO-35
|
JESD-609 Code |
|
e0
|
Qualification Status |
|
Qualified
|
Reference Standard |
|
MIL-19500/437
|
Terminal Finish |
|
TIN LEAD
|
|
|
|
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