CD5531B
vs
CD5531B
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROSEMI CORP
|
Package Description |
DIE-1
|
DIE-1
|
Reach Compliance Code |
compliant
|
unknown
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
ZENER DIODE
|
ZENER DIODE
|
Dynamic Impedance-Max |
80 Ω
|
80 Ω
|
JESD-30 Code |
S-XUUC-N1
|
S-XUUC-N1
|
JESD-609 Code |
e0
|
e0
|
Number of Elements |
1
|
1
|
Number of Terminals |
1
|
1
|
Operating Temperature-Max |
200 °C
|
200 °C
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
UNCASED CHIP
|
UNCASED CHIP
|
Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
Power Dissipation-Max |
0.5 W
|
0.5 W
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Reference Voltage-Nom |
11 V
|
11 V
|
Surface Mount |
YES
|
YES
|
Technology |
ZENER
|
ZENER
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Position |
UPPER
|
UPPER
|
Voltage Tol-Max |
5%
|
5%
|
Working Test Current |
1 mA
|
1 mA
|
Base Number Matches |
1
|
2
|
Pbfree Code |
|
No
|
Part Package Code |
|
DIE
|
Pin Count |
|
2
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8541.10.00.50
|
|
|
|
Compare CD5531B with alternatives
Compare CD5531B with alternatives