CD54HCU04F/3
vs
935300228115
feature comparison
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
HARRIS SEMICONDUCTOR
|
NXP SEMICONDUCTORS
|
Package Description |
,
|
HVQCCN,
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
HC/UH
|
HC/UH
|
JESD-30 Code |
R-CDIP-T14
|
R-PQCC-N14
|
Logic IC Type |
INVERTER
|
INVERTER
|
Number of Functions |
6
|
6
|
Number of Inputs |
1
|
1
|
Number of Terminals |
14
|
14
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-40 °C
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
HVQCCN
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Propagation Delay (tpd) |
105 ns
|
105 ns
|
Qualification Status |
Not Qualified
|
|
Supply Voltage-Max (Vsup) |
6 V
|
6 V
|
Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
Surface Mount |
NO
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
AUTOMOTIVE
|
Terminal Form |
THROUGH-HOLE
|
NO LEAD
|
Terminal Position |
DUAL
|
QUAD
|
Base Number Matches |
3
|
2
|
Length |
|
3 mm
|
Screening Level |
|
AEC-Q100
|
Seated Height-Max |
|
1 mm
|
Supply Voltage-Nom (Vsup) |
|
5 V
|
Terminal Pitch |
|
0.5 mm
|
Width |
|
2.5 mm
|
|
|
|
Compare CD54HCU04F/3 with alternatives