CD54HCT74F3 vs 74HCT74N,652 feature comparison

CD54HCT74F3 Intersil Corporation

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74HCT74N,652 NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer HARRIS SEMICONDUCTOR NXP SEMICONDUCTORS
Package Description , 0.300 INCH, PLASTIC, MO-001, SOT-27-1, DIP-14
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HCT HCT
JESD-30 Code R-CDIP-T14 R-PDIP-T14
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Number of Bits 1 1
Number of Functions 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 53 ns 53 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
fmax-Min 50 MHz 18 MHz
Base Number Matches 2 1
Rohs Code Yes
Part Package Code DIP
Pin Count 14
Manufacturer Package Code SOT27-1
Factory Lead Time 4 Weeks
Samacsys Manufacturer NXP
JESD-609 Code e4
Length 19.025 mm
Load Capacitance (CL) 50 pF
Max Frequency@Nom-Sup 18000000 Hz
Max I(ol) 0.004 A
Package Equivalence Code DIP14,.3
Packing Method TUBE
Seated Height-Max 4.2 mm
Terminal Finish NICKEL PALLADIUM GOLD
Terminal Pitch 2.54 mm
Width 7.62 mm

Compare CD54HCT74F3 with alternatives

Compare 74HCT74N,652 with alternatives