CD54HCT688F3A
vs
74HCT688NB
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
Rohs Code
No
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
TEXAS INSTRUMENTS INC
NXP SEMICONDUCTORS
Part Package Code
DIP
Package Description
CERAMIC, DIP-20
DIP,
Pin Count
20
Reach Compliance Code
not_compliant
unknown
ECCN Code
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
CASCADABLE
CASCADABLE
Family
HCT
HCT
JESD-30 Code
R-GDIP-T20
R-PDIP-T20
JESD-609 Code
e0
Length
24.195 mm
26.73 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
MAGNITUDE COMPARATOR
IDENTITY COMPARATOR
Max I(ol)
0.004 A
Number of Bits
8
8
Number of Functions
8
1
Number of Terminals
20
20
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-40 °C
Output Polarity
INVERTED
INVERTED
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP20,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Packing Method
TUBE
Power Supply Current-Max (ICC)
0.08 mA
Prop. Delay@Nom-Sup
42 ns
Propagation Delay (tpd)
51 ns
51 ns
Qualification Status
Not Qualified
Not Qualified
Screening Level
38535Q/M;38534H;883B
Seated Height-Max
5.08 mm
4.2 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
AUTOMOTIVE
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
3
2
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