CD54HCT688F3A vs 74HCT688PW-T feature comparison

CD54HCT688F3A Texas Instruments

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74HCT688PW-T NXP Semiconductors

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Pbfree Code Yes Yes
Rohs Code No Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC NXP SEMICONDUCTORS
Part Package Code DIP TSSOP
Package Description CERAMIC, DIP-20 TSSOP,
Pin Count 20 20
Reach Compliance Code not_compliant unknown
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature CASCADABLE CASCADABLE
Family HCT HCT
JESD-30 Code R-GDIP-T20 R-PDSO-G20
JESD-609 Code e0 e4
Length 24.195 mm 6.5 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type MAGNITUDE COMPARATOR IDENTITY COMPARATOR
Max I(ol) 0.004 A
Number of Bits 8 8
Number of Functions 8 1
Number of Terminals 20 20
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Output Polarity INVERTED INVERTED
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP TSSOP
Package Equivalence Code DIP20,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method TUBE
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT SPECIFIED
Power Supply Current-Max (ICC) 0.08 mA
Prop. Delay@Nom-Sup 42 ns
Propagation Delay (tpd) 51 ns 51 ns
Qualification Status Not Qualified Not Qualified
Screening Level 38535Q/M;38534H;883B
Seated Height-Max 5.08 mm 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Finish Tin/Lead (Sn/Pb) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Width 7.62 mm 4.4 mm
Base Number Matches 1 1
Moisture Sensitivity Level 1

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