CD54HCT564F3A vs GD54HCT563J feature comparison

CD54HCT564F3A Intersil Corporation

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GD54HCT563J LG Semicon Co Ltd

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTERSIL CORP LG SEMICON CO LTD
Package Description DIP-20 DIP, DIP20,.3
Reach Compliance Code not_compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-XDIP-T20 R-XDIP-T20
JESD-609 Code e0 e0
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type D FLIP-FLOP D LATCH
Max Frequency@Nom-Sup 16000000 Hz
Max I(ol) 0.006 A 0.006 A
Number of Functions 8 1
Number of Terminals 20 20
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Output Characteristics 3-STATE 3-STATE
Package Body Material CERAMIC CERAMIC
Package Code DIP DIP
Package Equivalence Code DIP20,.3 DIP20,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Screening Level 38535Q/M;38534H;883B
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE
Base Number Matches 3 2
Number of Bits 8
Prop. Delay@Nom-Sup 48 ns