CD54HCT533F3A
vs
74HCT534PW
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTERSIL CORP
NXP SEMICONDUCTORS
Package Description
DIP, DIP20,.3
TSSOP,
Reach Compliance Code
not_compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
R-XDIP-T20
R-PDSO-G20
JESD-609 Code
e0
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
D LATCH
BUS DRIVER
Max I(ol)
0.006 A
Number of Bits
8
8
Number of Functions
1
1
Number of Terminals
20
20
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Package Body Material
CERAMIC
PLASTIC/EPOXY
Package Code
DIP
TSSOP
Package Equivalence Code
DIP20,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Prop. Delay@Nom-Sup
51 ns
Qualification Status
Not Qualified
Not Qualified
Screening Level
38535Q/M;38534H;883B
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
AUTOMOTIVE
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
0.65 mm
Terminal Position
DUAL
DUAL
Base Number Matches
4
1
Family
HCT
Length
6.5 mm
Number of Ports
2
Output Polarity
INVERTED
Propagation Delay (tpd)
45 ns
Seated Height-Max
1.1 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Width
4.4 mm
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