CD54HCT4514F/3A
vs
74HC4514U
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
HARRIS SEMICONDUCTOR
|
NXP SEMICONDUCTORS
|
Reach Compliance Code |
unknown
|
unknown
|
Additional Feature |
ADDRESS LATCHES
|
|
Family |
HCT
|
HC/UH
|
JESD-30 Code |
R-CDIP-T24
|
X-XUUC-N
|
JESD-609 Code |
e0
|
|
Logic IC Type |
OTHER DECODER/DRIVER
|
OTHER DECODER/DRIVER
|
Number of Functions |
1
|
1
|
Number of Terminals |
24
|
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-40 °C
|
Output Polarity |
TRUE
|
TRUE
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
UNSPECIFIED
|
Package Shape |
RECTANGULAR
|
UNSPECIFIED
|
Package Style |
IN-LINE
|
UNCASED CHIP
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Propagation Delay (tpd) |
83 ns
|
345 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Voltage-Max (Vsup) |
5.5 V
|
6 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
2 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
4.5 V
|
Surface Mount |
NO
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
AUTOMOTIVE
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
THROUGH-HOLE
|
NO LEAD
|
Terminal Position |
DUAL
|
UPPER
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Base Number Matches |
2
|
1
|
Part Package Code |
|
WAFER
|
Package Description |
|
DIE,
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8542.39.00.01
|
Input Conditioning |
|
LATCHED
|
Package Code |
|
DIE
|
Package Equivalence Code |
|
DIE OR CHIP
|
|
|
|
Compare CD54HCT4514F/3A with alternatives
Compare 74HC4514U with alternatives