CD54HCT4514F/3A vs 74HC4514U feature comparison

CD54HCT4514F/3A Intersil Corporation

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74HC4514U NXP Semiconductors

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Rohs Code No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer HARRIS SEMICONDUCTOR NXP SEMICONDUCTORS
Reach Compliance Code unknown unknown
Additional Feature ADDRESS LATCHES
Family HCT HC/UH
JESD-30 Code R-CDIP-T24 X-XUUC-N
JESD-609 Code e0
Logic IC Type OTHER DECODER/DRIVER OTHER DECODER/DRIVER
Number of Functions 1 1
Number of Terminals 24
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material CERAMIC, METAL-SEALED COFIRED UNSPECIFIED
Package Shape RECTANGULAR UNSPECIFIED
Package Style IN-LINE UNCASED CHIP
Peak Reflow Temperature (Cel) NOT SPECIFIED
Propagation Delay (tpd) 83 ns 345 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 6 V
Supply Voltage-Min (Vsup) 4.5 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE NO LEAD
Terminal Position DUAL UPPER
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Number Matches 2 1
Part Package Code WAFER
Package Description DIE,
ECCN Code EAR99
HTS Code 8542.39.00.01
Input Conditioning LATCHED
Package Code DIE
Package Equivalence Code DIE OR CHIP

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