CD54HCT4053F3A
vs
935174980112
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
HARRIS SEMICONDUCTOR
|
NXP SEMICONDUCTORS
|
| Package Description |
DIP, DIP16,.3
|
SSOP,
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog IC - Other Type |
SPDT
|
SINGLE-ENDED MULTIPLEXER
|
| JESD-30 Code |
R-GDIP-T16
|
R-PDSO-G16
|
| JESD-609 Code |
e0
|
e4
|
| Number of Channels |
1
|
2
|
| Number of Functions |
3
|
3
|
| Number of Terminals |
16
|
16
|
| On-state Resistance-Max (Ron) |
270 Ω
|
165 Ω
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
SSOP
|
| Package Equivalence Code |
DIP16,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE, SHRINK PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Signal Current-Max |
0.025 A
|
|
| Supply Current-Max (Isup) |
0.16 mA
|
|
| Surface Mount |
NO
|
YES
|
| Switch-on Time-Max |
48 ns
|
37 ns
|
| Switching |
BREAK-BEFORE-MAKE
|
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
AUTOMOTIVE
|
| Terminal Finish |
TIN LEAD
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
3
|
2
|
| Pbfree Code |
|
Yes
|
| Part Package Code |
|
SOIC
|
| Pin Count |
|
16
|
| Length |
|
6.2 mm
|
| Moisture Sensitivity Level |
|
1
|
| Off-state Isolation-Nom |
|
50 dB
|
| On-state Resistance Match-Nom |
|
2 Ω
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Seated Height-Max |
|
2 mm
|
| Supply Voltage-Nom (Vsup) |
|
6 V
|
| Switch-off Time-Max |
|
28 ns
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
| Width |
|
5.3 mm
|
|
|
|
Compare CD54HCT4053F3A with alternatives
Compare 935174980112 with alternatives