CD54HCT366F/3 vs 74HCT366PW,112 feature comparison

CD54HCT366F/3 Intersil Corporation

Buy Now Datasheet

74HCT366PW,112 NXP Semiconductors

Buy Now Datasheet
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer HARRIS SEMICONDUCTOR NXP SEMICONDUCTORS
Package Description , 4.40 MM, PLASTIC, MO-153, SOT-403-1, TSSOP-16
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature WITH DUAL OUTPUT ENABLE WITH DUAL OUTPUT ENABLE
Family HCT HCT
JESD-30 Code R-CDIP-T16 R-PDSO-G16
Logic IC Type BUS DRIVER BUS DRIVER
Number of Bits 6 6
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity INVERTED INVERTED
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code DIP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd) 41 ns 36 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Form THROUGH-HOLE GULL WING
Terminal Position DUAL DUAL
Base Number Matches 3 1
Rohs Code Yes
Part Package Code TSSOP
Pin Count 16
Manufacturer Package Code SOT403-1
Factory Lead Time 4 Weeks
Control Type ENABLE LOW
JESD-609 Code e4
Length 5 mm
Load Capacitance (CL) 50 pF
Max I(ol) 0.006 A
Moisture Sensitivity Level 1
Package Equivalence Code TSSOP16,.25
Packing Method TUBE
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 36 ns
Seated Height-Max 1.1 mm
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Pitch 0.65 mm
Time@Peak Reflow Temperature-Max (s) 30
Width 4.4 mm

Compare CD54HCT366F/3 with alternatives

Compare 74HCT366PW,112 with alternatives