CD54HCT244F/3A
vs
MC74HCT244AN
feature comparison
All Stats
Differences Only
Rohs Code
No
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
HARRIS SEMICONDUCTOR
MOTOROLA INC
Package Description
,
DIP,
Reach Compliance Code
unknown
unknown
Family
HCT
HCT
JESD-30 Code
R-CDIP-T20
R-PDIP-T20
JESD-609 Code
e0
e0
Logic IC Type
BUS DRIVER
BUS DRIVER
Number of Bits
4
4
Number of Functions
2
2
Number of Ports
2
2
Number of Terminals
20
20
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Propagation Delay (tpd)
38 ns
30 ns
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Base Number Matches
2
5
Part Package Code
DIP
Pin Count
20
HTS Code
8542.39.00.01
Length
26.415 mm
Load Capacitance (CL)
50 pF
Package Code
DIP
Seated Height-Max
4.57 mm
Terminal Pitch
2.54 mm
Width
7.62 mm
Compare CD54HCT244F/3A with alternatives
Compare MC74HCT244AN with alternatives