CD54HCT153H/3
vs
M74HC153M1
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
HARRIS SEMICONDUCTOR
STMICROELECTRONICS
Package Description
DIE,
SOP, SOP16,.25
Reach Compliance Code
unknown
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
HCT
HC/UH
JESD-30 Code
X-XUUC-N16
R-PDSO-G16
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Number of Functions
2
2
Number of Inputs
4
4
Number of Outputs
1
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Output Polarity
TRUE
TRUE
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
DIE
SOP
Package Equivalence Code
DIE OR CHIP
SOP16,.25
Package Shape
UNSPECIFIED
RECTANGULAR
Package Style
UNCASED CHIP
SMALL OUTLINE
Propagation Delay (tpd)
51 ns
49 ns
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.5 V
6 V
Supply Voltage-Min (Vsup)
4.5 V
2 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Form
NO LEAD
GULL WING
Terminal Position
UPPER
DUAL
Base Number Matches
2
1
Pbfree Code
Rohs Code
Part Package Code
SOIC
Pin Count
16
JESD-609 Code
e0
Length
9.9 mm
Load Capacitance (CL)
50 pF
Max I(ol)
0.004 A
Prop. Delay@Nom-Sup
49 ns
Seated Height-Max
1.75 mm
Terminal Finish
TIN LEAD
Terminal Pitch
1.27 mm
Width
3.9 mm
Compare CD54HCT153H/3 with alternatives
Compare M74HC153M1 with alternatives