CD54HCT139F
vs
TC74VHC238FS
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
HARRIS SEMICONDUCTOR
TOSHIBA CORP
Package Description
DIP-16
LSSOP, SSOP16,.25
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Family
HCT
AHC/VHC
Input Conditioning
STANDARD
STANDARD
JESD-30 Code
R-GDIP-T16
R-PDSO-G16
JESD-609 Code
e0
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
2-LINE TO 4-LINE DECODER
3-LINE TO 8-LINE DECODER
Max I(ol)
0.004 A
0.008 A
Number of Functions
2
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Output Polarity
INVERTED
TRUE
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
LSSOP
Package Equivalence Code
DIP16,.3
SSOP16,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
Prop. Delay@Nom-Sup
51 ns
11.5 ns
Propagation Delay (tpd)
51 ns
18 ns
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
2 V
Supply Voltage-Nom (Vsup)
5 V
3.3 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
0.65 mm
Terminal Position
DUAL
DUAL
Base Number Matches
3
2
Part Package Code
SOIC
Pin Count
16
Length
5 mm
Seated Height-Max
1.6 mm
Width
4.4 mm
Compare CD54HCT139F with alternatives
Compare TC74VHC238FS with alternatives