CD54HCT132F/3
vs
M74HC132F1
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
HARRIS SEMICONDUCTOR
SGS-ATES COMPONENTI ELECTRONICI S P A
Package Description
,
DIP, DIP14,.3
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
HCT
JESD-30 Code
R-CDIP-T14
R-XDIP-T14
Logic IC Type
NAND GATE
NAND GATE
Number of Functions
4
Number of Inputs
2
Number of Terminals
14
14
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
50 ns
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.5 V
6 V
Supply Voltage-Min (Vsup)
4.5 V
2 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
3
2
Rohs Code
No
JESD-609 Code
e0
Package Equivalence Code
DIP14,.3
Schmitt Trigger
YES
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Pitch
2.54 mm
Compare CD54HCT132F/3 with alternatives