CD54HC597F/3
vs
M54HC597F1R
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
HARRIS SEMICONDUCTOR
STMICROELECTRONICS
Package Description
,
DIP, DIP16,.3
Reach Compliance Code
unknown
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Count Direction
RIGHT
RIGHT
Family
HC/UH
HC/UH
JESD-30 Code
R-CDIP-T16
R-GDIP-T16
Logic IC Type
PARALLEL IN SERIAL OUT
PARALLEL IN SERIAL OUT
Number of Bits
8
8
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Output Polarity
TRUE
TRUE
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
265 ns
220 ns
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
4.5 V
4.5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
fmax-Min
60 MHz
20 MHz
Base Number Matches
2
1
Pbfree Code
Rohs Code
Part Package Code
DIP
Pin Count
16
JESD-609 Code
e0
Load Capacitance (CL)
50 pF
Max Frequency@Nom-Sup
20000000 Hz
Package Equivalence Code
DIP16,.3
Seated Height-Max
5.08 mm
Terminal Finish
TIN LEAD
Terminal Pitch
2.54 mm
Width
7.62 mm
Compare CD54HC597F/3 with alternatives
Compare M54HC597F1R with alternatives